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An Introduction to Electronics Systems Packaging
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An Introduction to Electronics Systems Packaging

Course Description:

The objective of this course is to sensitize the undergraduate students and graduate students to the all-important multidisciplinary area of electronics systems packaging.The course will discuss all the important facets of packaging at three major levels, namely, chip level, board level and system level.

  • Instructor(s) G.V. Mahesh
  • University
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  • Start Date Always Available
  • Duration Always Available
  • Main Language English
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